What Are the Two Indigenously Developed Silicon Photonics Products Launched by IIT Madras?

Synopsis
Key Takeaways
- IIT Madras launched two innovative silicon photonics products.
- The quantum random number generator (QRNG) module is a key achievement.
- Applications of QRNG include IT security and quantum cryptography.
- The products were developed at CoE-CPPICS.
- Commercial access will be through LightOnChip.
New Delhi, May 3 (NationPress) The Indian Institute of Technology (IIT) Madras has unveiled two indigenously created silicon photonics products, marking a milestone for India.
These innovations, designed and developed at the CoE-CPPICS within IIT Madras, are poised for swift market integration.
“The field-deployable silicon photonic-based quantum random number generator (QRNG) module represents a significant achievement for India. This product has been delivered to DRDO to support advanced quantum cryptography,” stated S. Krishnan, IAS, Secretary, MeitY, while commending CoE-CPPICS.
Among the two products launched are the Fibre-Array Unit (FAU) attachment tool for Photonic Chip Packaging and the silicon photonic QRNG (Quantum Random Number Generator).
The QRNG module will be commercially available to interested clients through the CPPICS spin-off startup, LightOnChip.
Key applications of QRNG include IT security for military and defense, cryptographic algorithms, quantum key distribution (QKD), scientific modeling and simulations, financial transactions, blockchain, one-time passwords (OTP), and gaming applications, as stated by the Institute.
“Silicon Photonics is a cutting-edge technology that will undoubtedly facilitate the design of more efficient and complex hardware in the future. I am thrilled that the Silicon Photonics CoE-CPPICS at IIT Madras has developed demonstrable products ready for market adoption. We anticipate the emergence of many such products in the future,” remarked Prof. V. Kamakoti, Director, IIT Madras.
Photonic packaging and assembly represent a complex, multidisciplinary design and manufacturing challenge. To ensure a Photonic Integrated Circuit (PIC)-enabled module meets specifications, sub-micron precision alignment and bonding processes are crucial.
Simultaneously, effective thermal management is essential to uphold the thermo-optic stability of signals.
CoE-CPPICS aims to deliver enhanced solutions for microwave and quantum photonics applications, such as advanced photonic processors for high-performance RF transceivers, scalable linear optical quantum computing processors for next-gen qubit computation, and chip-level quantum key generation and distribution circuits.
CPPICS is actively engaged in developing indigenous PIC design rules and hardware infrastructure for precision packaging tailored to system-level applications.