India Semiconductor Mission: 5 of 12 approved chip projects now in production under Semicon 2.0
Synopsis
Key Takeaways
India's semiconductor strategy has decisively shifted from policy design to on-ground execution, with 5 of the 12 approved manufacturing projects already in commercial production, Amitesh Kumar Sinha, Additional Secretary at the Ministry of Electronics and Information Technology (MeitY) and CEO of the India Semiconductor Mission (ISM), said on 5 November 2026. The announcement, made in New Delhi at the inaugural ISIG Executive Summit India 2026, signals a tangible acceleration in India's chip ambitions under the Semicon 2.0 framework.
What Semicon 2.0 Covers
Speaking on the second and final day of the summit, Sinha outlined a broader vision than pure manufacturing. 'Semicon 2.0 is about building the broader ecosystem, including design companies, materials, chemicals, gases and equipment, alongside manufacturing, R&D and talent,' he said. The framework extends the original India Semiconductor Mission's focus on fab incentives to encompass the full value chain — from upstream materials to downstream design services.
According to Sinha, India's large domestic market, deep engineering talent pool, and government incentive structures are key competitive advantages. However, he noted that global technology partnerships and resilient supply chains will be essential for the country to consolidate its position in the global semiconductor order.
The Summit and Its Key Discussions
The ISIG Executive Summit — held under the theme 'Enabling the Intelligent Future: Advanced Semiconductors, AI, Data Centers and Power Electronics' — was the first edition of the global forum to be staged in India. It brought together senior executives, global technology leaders, researchers, investors, and government stakeholders to map India's next phase in the worldwide chip ecosystem.
Discussions at the summit spanned advanced packaging, outsourced semiconductor assembly and test (OSAT), power electronics, and wide-bandgap technologies such as silicon carbide (SiC) and gallium nitride (GaN). Delegates also examined the surge in AI and data-centre demand and the development of India's domestic design, materials, equipment, and supply-chain base.
Bihar Pact and Industry Reactions
On the sidelines, ISIG signed a strategic cooperation agreement with the Bihar government to develop the state's semiconductor and electronics ecosystem — a notable move that extends India's chip geography beyond the established hubs of Gujarat, Assam, and the technology corridors of Bengaluru and Hyderabad.
Dr. Shalu Agarwal, General Manager of India and Head of Power Semiconductor at ISIG, described the summit as a milestone. 'This first India edition showed what becomes possible when global industry, investors and government are in the same room,' she said. 'India's opportunity in advanced packaging and power electronics is real, and our role is to connect it with the technology, capital and partnerships that will help it scale,' she added.
What Comes Next
The next edition of the ISIG Executive Summit is scheduled in India between 30 November and 1 December 2027, signalling continued institutional momentum. With five projects already producing commercially, the focus now shifts to ramping the remaining seven approved facilities to production — and to whether Semicon 2.0's ecosystem-building ambitions translate into competitive supply-chain depth in time to capture global diversification trends driven by US-China tech decoupling.