India-US AI and chip partnership shifts from policy to projects
Synopsis
Key Takeaways
India and the United States have significantly deepened cooperation across semiconductors, artificial intelligence, quantum technologies, and critical minerals, with senior officials from both nations signalling that the bilateral technology partnership is now transitioning from broad policy frameworks to concrete projects and trusted supply chains. The shift was underscored at a high-level roundtable held in Washington on 28 June, hosted by the US-India Strategic Partnership Forum (USISPF) in partnership with the Embassy of India and the Silverado Policy Accelerator.
What Officials Said
India's Ambassador to the United States, Vinay Kwatra, told the roundtable that the two countries possess complementary strengths that make collaboration in emerging technologies particularly powerful. 'The opportunity before the United States and India extends from chips to neural networks. India's mission-based approach across semiconductors, AI, and quantum technologies, combined with America's innovation ecosystem, creates enormous potential for collaboration,' he said. Kwatra added that the goal was to 'build trusted, resilient technology ecosystems while ensuring secure access to the critical infrastructure that powers these emerging technologies.'
S. Krishnan, Secretary in India's Ministry of Electronics and Information Technology (MeitY), said India's electronics manufacturing ecosystem had 'expanded dramatically' and that semiconductor fabrication was 'now becoming a reality.' He noted that the next phase of India's Semiconductor Mission would build on this momentum, and that India's talent base, digital public infrastructure, and AI capabilities created an opportunity to 'develop solutions not just for India, but for the world.'
K. Nagaraj Naidu, Additional Secretary (Americas) at the Ministry of External Affairs, described the relationship as a 'comprehensive strategic partnership fit for the 21st century,' adding that through initiatives spanning AI, quantum technologies, critical minerals, advanced energy, and trusted supply chains, the two sides were 'now moving from principles to projects.' He emphasised that the private sector would play an 'indispensable role in transforming these frameworks into real-world outcomes.'
Industry and US Government Perspectives
Mukesh Aghi, President and CEO of the USISPF, said microchips and critical minerals would define the future of the global economy, and that the United States and India were 'uniquely positioned to build the trusted technology partnership of the 21st century.' He noted that while governments could establish enabling frameworks, 'it is industry that will ultimately drive execution, innovation, and investment.'
The roundtable also featured Bill Guidera, Deputy Under Secretary for Innovation and Engagement at the US Department of Commerce, and Christopher Saldana, Deputy Assistant Secretary in the Office of Critical Minerals, Materials, and Manufacturing at the US Department of Energy — signalling high-level US federal engagement in the partnership.
Why This Moment Matters
The Washington roundtable comes amid a broader global scramble to secure semiconductor supply chains, reduce dependence on single-source chip producers, and establish trusted AI infrastructure. India's Semiconductor Mission, backed by significant government investment, has already attracted commitments from global chipmakers. This is not the first high-level dialogue on the subject — the Initiative on Critical and Emerging Technology (iCET), launched in 2023, set the strategic architecture — but the emphasis on moving 'from principles to projects' marks a notable escalation in urgency on both sides.
Organisers said closer collaboration between governments, industry, and research institutions would be essential as the two countries deepen cooperation in emerging technologies and resilient supply chains. The next steps in the partnership are expected to be driven significantly by the private sector, with USISPF positioned as a key convening body.