New Delhi, Feb 28 (NationPress) Today, Prime Minister Narendra Modi will unveil a state-of-the-art semiconductor Assembly, Testing, Marking and Packaging (ATMP) facility in Sanand. This inauguration represents a pivotal advancement in India’s aspirations for semiconductor manufacturing, aligning with the National Semiconductor Mission.

The Sanand facility, developed by Micron Semiconductor Technology India Pvt. Ltd., has been established with a hefty investment of Rs 22,516 crore.

This facility will be responsible for the assembly, testing, marking, and packaging of semiconductor memory products, such as solid-state drives (SSDs) and DRAM and NAND devices intended for the global marketplace.

Currently, a dedicated team of 2,000 employees is operational at the plant, with plans to expand the workforce to approximately 5,000 in the coming years.

Notably, individuals with disabilities are also part of the workforce, contributing as operators and technicians, with opportunities available for skilled candidates.

The project has adhered to its scheduled timeline, and officials from the state government have proclaimed that Gujarat is positioning itself as a leader in semiconductor manufacturing within India.

According to Sanjay Mehrotra, President and CEO of Micron Technology, memory and storage are essential in emerging technologies. He stated, "In today’s tech-driven age, especially concerning Artificial Intelligence, memory and storage are vital components. Without robust memory and storage, AI systems cannot operate effectively."

He further noted that as AI applications demand quicker and real-time responses, the need for advanced memory solutions is on the rise.

The semiconductor manufacturing process begins with sand, from which pure silicon is derived. This silicon is then melted and formed into cylindrical ingots and sliced into thin wafers.

At fabrication facilities, intricate electronic patterns are printed onto the wafers, layered through photolithography, which establishes transistors and memory structures.

Subsequently, the wafers are segmented into individual chips, which are sent to the ATMP facility in Sanand for assembly, followed by performance and reliability testing, including evaluations of speed and memory capacity.

After passing tests, the chips are marked and packaged for distribution.

The Sanand unit is set to process advanced DRAM and NAND wafers produced at the company's global factories, converting them into market-ready memory products.

The company has announced that its output will serve international markets and meet the increasing demand for memory and storage solutions, particularly for Artificial Intelligence applications.