Will PM Modi Attend the HCL-Foxconn Chip Project Groundbreaking Ceremony?
Synopsis
Key Takeaways
New Delhi, Feb 20 (NationPress) Prime Minister Narendra Modi is set to join the groundbreaking event for the Rs 3,700 crore HCL-Foxconn joint venture project, India Chip Pvt. Ltd., located in the Yamuna Expressway Industrial Development Authority (YEIDA) area near the Noida International Airport in Jewar, Uttar Pradesh on February 21 via video link, as per a statement from the PMO released on Friday.
The creation of a semiconductor facility by the Taiwanese electronics giant Foxconn in partnership with India's HCL Group signifies a landmark achievement in India's pursuit of technological independence and aligns with the Prime Minister's vision of establishing India as a reliable global hub for advanced electronics and semiconductor production.
This Outsourced Semiconductor Assembly and Test (OSAT) center at YEIDA will be developed by India Chip Pvt. Ltd. under the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP), involving a total investment surpassing Rs 3,700 crore.
The initiative supports the government’s strategy to bolster domestic manufacturing, decrease reliance on imports, and cultivate resilient global supply chains.
Anticipated to significantly impact critical sectors like mobile devices, tablets, laptops, automotive, consumer electronics, and various other gadgets, this project is a boost to India’s semiconductor ecosystem, encouraging innovation, skill enhancement, and technology transfer.
The facility is projected to generate thousands of direct and indirect job opportunities for engineers, technicians, and other professionals, while also stimulating growth in ancillary industries, according to the statement.
The HCL-Foxconn collaboration highlights India's increasing prominence in the global semiconductor sector and marks a pivotal step towards establishing a robust and self-sufficient electronics manufacturing framework.
Foxconn possesses a 40 percent equity share in the venture and has already invested $37.2 million (approximately Rs 312 crore). The Taiwanese firm may invest up to Rs 424 crore in the venture.
YEIDA has designated about 48 acres of land for this project in Sector 28, Jewar, adjacent to the forthcoming Noida International Airport.
The facility will operate as an outsourced semiconductor assembly and testing plant dedicated to display driver integrated circuits utilized in smartphones, laptops, and automotive applications.