Intel Corporation and 3D Glass Solutions have signed a memorandum of understanding with the Odisha government to explore setting up an advanced semiconductor glass core packaging substrate manufacturing facility in the state — a development that could significantly advance India's ambitions to emerge as a global semiconductor hub.

The MoU was signed at Intel's headquarters in Santa Clara, California, on 1 June 2025, according to a media statement. The agreement is exploratory in nature, with the project still subject to regulatory approvals, funding support from both state and Central governments, and other business conditions.

What the Facility Could Mean for Odisha

If realised, the proposed facility would rank among the largest technology investments in eastern India. Officials and industry leaders say it could position Odisha as an emerging destination for semiconductor manufacturing, advanced packaging, artificial intelligence infrastructure, next-generation data centres, and broader digital technologies.

The scale of ambition is notable: this is not merely a single-product plant but a potential anchor for an integrated technology ecosystem in a state that has historically been associated with steel and mining rather than high-tech manufacturing.

The US-India Technology Diplomacy Angle

India's Ambassador to the United States, Vinay Kwatra, linked the initiative directly to the bilateral technology cooperation framework. He said the MoU advances the vision articulated by Prime Minister Narendra Modi and US President Donald J. Trump during Modi's visit to Washington, D.C. in February 2025.

'This initiative marks an important milestone in advancing the vision articulated by Prime Minister Narendra Modi and President Donald J. Trump during the Prime Minister's visit to Washington, D.C., in February 2025, for collaboration between the two countries in advanced manufacturing under the US-India TRUST (Transforming relationship utilising strategic technology) Initiative,' Kwatra said.

The TRUST Initiative, announced earlier this year, is designed to deepen cooperation between the two countries in semiconductors, telecommunications, and defence technology — areas where both governments have flagged strategic interest.

What the Government Said

Union Electronics and Information Technology Minister Ashwini Vaishnaw said the proposal aligns with India's push to expand domestic manufacturing. 'This initiative reflects India's larger vision of strengthening domestic manufacturing capabilities and positioning the country as a global economic powerhouse,' he said.

Odisha Chief Minister Mohan Charan Majhi described the development as a turning point for the state. 'Today marks the beginning of a new chapter in Odisha's growth story,' Majhi said, adding that the initiative goes beyond semiconductor manufacturing to encompass AI infrastructure, data centres, and digital transformation. 'Our vision is to build a vibrant ecosystem that inspires future generations, creates world-class opportunities for our youth, attracts leading global technology companies, and firmly places Odisha on the global semiconductor map,' he added.

Industry Voices

Babu Mandava, Chief Executive Officer of 3D Glass Solutions, said the collaboration with Intel and the Odisha government could help establish India as a key global hub for advanced glass substrates and semiconductor packaging, supporting sectors such as artificial intelligence, high-performance computing, and next-generation electronics.

Naga Chandrasekaran, Executive Vice President and General Manager of Intel Foundry, said the company was 'proud to collaborate with 3DGS in exploring this opportunity with the Government of Odisha,' and expressed enthusiasm about accelerating the commercialisation of next-generation advanced packaging solutions globally.

What Happens Next

The MoU is a preliminary agreement, and significant milestones — including regulatory clearances, confirmed funding commitments, and finalised business terms — remain ahead. Analysts note that India's semiconductor ambitions have attracted multiple MoUs in recent years, but converting signed agreements into operational fabs and packaging facilities has proven to be the harder challenge. The Odisha project's progress will be closely watched as a test of whether eastern India can attract advanced technology investment at scale.