The Chief Minister's Office of Odisha announced on Saturday, 30 May 2026 that the Government of Odisha has signed a landmark Memorandum of Understanding with Intel Corporation and 3DGS Inc. for the establishment of an Advanced Packaging Glass Core Substrate Manufacturing Facility in the state, marking a significant step in Odisha's industrial transformation toward next-generation technologies.

Context

The MoU was formalised between the Government of Odisha, Intel Corporation — one of the world's largest semiconductor companies — and 3DGS Inc., a firm focused on advanced packaging technologies. The agreement envisages setting up a facility dedicated to Glass Core Substrate manufacturing, a critical component in advanced semiconductor packaging that enables higher performance and miniaturisation in chips. The Chief Minister's Office tagged PMO India in the announcement, signalling alignment with the national semiconductor push.

Policy Backdrop

The MoU sits squarely within India's broader semiconductor ambitions. The Government of India launched the India Semiconductor Mission in 2021 with an outlay of Rs 76,000 crore to build domestic chip fabrication, assembly, and test capabilities and reduce the country's heavy dependence on imports. The mission has catalysed a wave of state-level agreements as coastal and industrial states compete to attract semiconductor investment by highlighting infrastructure, port access, and power availability.

Odisha brings a long-established industrial base — anchored in steel, mining, and heavy manufacturing — to this new push. State officials have positioned this foundation as a logistical and workforce advantage for capital-intensive advanced manufacturing projects. The Glass Core Substrate facility would represent a qualitative leap, moving the state up the value chain from raw material processing toward precision electronics production.

Stakeholders and Impact

For Intel Corporation, the Odisha agreement is part of its wider strategy to diversify semiconductor supply chains beyond traditional geographies. Advanced packaging — rather than primary chip fabrication — is a segment where India has been specifically targeted under central incentive schemes, making Odisha a viable location for such investment. 3DGS Inc. brings specialised expertise in the Glass Core Substrate segment, which is increasingly seen as a successor technology to conventional organic substrates in high-end chip packaging.

The facility, once operational, is expected to generate employment opportunities for Odisha's industrial workforce and create a local supplier ecosystem. Semiconductor packaging plants typically require a combination of skilled engineers, precision technicians, and supply-chain support services, offering a broader employment multiplier than primary extraction industries.

What's Next

Attention will now turn to the groundbreaking timeline, the total investment commitment, and any state-level fiscal incentives or skill-development programmes that Odisha may announce to support the facility. The involvement of PMO India in the announcement suggests possible dovetailing with central incentives under the India Semiconductor Mission. How quickly the project moves from MoU to ground-level construction will be a key indicator of the state's ability to execute on its semiconductor ambitions and compete with established electronics manufacturing hubs in Gujarat and Tamil Nadu.